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Publicationer information ikon
Modelling New Materials for
Microelectronics
Packaging
Referentgranskad
Kivilahti, J.
IEEE Transactions on Components,
Packaging
and Manufacturing Technology - Part B
1995
Publicationer information ikon
Packaging
of Photonic Integrated Circuits: Extended Abstract
Karppinen, Mikko
IMAPS Nordic Conference on
Microelectronics
Packaging
, NordPac 2023
2023
Publicationer information ikon
Vacuum
packaging
at wafer level for MEMS using gold-tin metallurgy
Referentgranskad
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S; Suni, Tommi; Dekker, James...
EMPC 2013
2013
Publicationer information ikon
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Referentgranskad
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer...
European
Microelectronics
Packaging
Conference
2013
Publicationer information ikon
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Referentgranskad
Suni, Tommi; Xu, Hongbo; Vuorinen, V.; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer,...
EMPC 2013
2013
Publicationer information ikon
Reliability of ACA joined thinned chips on rigid substrates under humid conditions
Referentgranskad
Frisk, Laura; Saarinen, Kirsi; Kokko, Kati
European
Microelectronics
&
Packaging
Conference EMPC
2011
Publicationer information ikon
Effects of different combinations of environmental tests on the reliability of UHF RFID tags
Referentgranskad
Frisk, Laura; Saarinen, Kirsi; Ukkonen, Leena
European
Microelectronics
&
Packaging
Conference EMPC
2011
Publicationer information ikon
Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing
Referentgranskad
Lahokallio, Sanna; Saarinen, Kirsi; Frisk, Laura
European
Microelectronics
&
Packaging
Conference EMPC
2011
Publicationer information ikon
Inspection of
microelectronics
packaging
using X-ray and scanning acoustic microscopies
Tian, D.; Rautioaho, Risto & Leppävuori, Seppo
-
1999
Publicationer information ikon
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror
Referentgranskad
DOI
10.23919/NORDPAC.2019.8760353
Ailas, Henri; Saarilahti, Jaakko; Pensala, Tuomas; Kiihamäki, Jyrki
IMAPS Nordic Annual Conference, NordPac 2019
2019
Modelling New Materials for
Microelectronics
Packaging
Referentgranskad
1995
Packaging
of Photonic Integrated Circuits: Extended Abstract
2023
Vacuum
packaging
at wafer level for MEMS using gold-tin metallurgy
Referentgranskad
2013
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Referentgranskad
2013
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Referentgranskad
2013
Reliability of ACA joined thinned chips on rigid substrates under humid conditions
Referentgranskad
2011
Effects of different combinations of environmental tests on the reliability of UHF RFID tags
Referentgranskad
2011
Changes in Water Absorption and Modulus of Elasticity of Flexible Printed Circuit Board Materials in High Humidity Testing
Referentgranskad
2011
Inspection of
microelectronics
packaging
using X-ray and scanning acoustic microscopies
1999
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror
Referentgranskad
DOI
10.23919/NORDPAC.2019.8760353
2019
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